Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation MSC.Nastran Thermal Analysis MSC.Nastran 2004 NAS104 Course Notes March 2004 MSC.Software Corporation United States MSC.Patran Support Tel: Fax: Tokyo, Japan Tel: Fax: Munich, Germany Tel: (+49) Fax: (+49) MacArthur Place Santa Ana, CA 92707, USA Tel: (714) Fax: (714) Web: Part Number: NA*V2004*Z*Z*Z*SM-NAS104-NT1

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation DISCLAIMER MSC.Software Corporation reserves the right to make changes in specifications and other information contained in this document without prior notice. The concepts, methods, and examples presented in this text are for illustrative and educational purposes only, and are not intended to be exhaustive or to apply to any particular engineering problem or design. MSC.Software Corporation assumes no liability or responsibility to any person or company for direct or indirect damages resulting from the use of any information contained herein. User Documentation: Copyright 2004 MSC.Software Corporation. Printed in U.S.A. All Rights Reserved. This notice shall be marked on any reproduction of this documentation, in whole or in part. Any reproduction or distribution of this document, in whole or in part, without the prior written consent of MSC.Software Corporation is prohibited. MSC and MSC. are registered trademarks and service marks of MSC.Software Corporation. NASTRAN is a registered trademark of the National Aeronautics and Space Administration. MSC.Nastran is an enhanced proprietary version developed and maintained by MSC.Software Corporation. MSC.Patran is a trademark of MSC.Software Corporation. All other trademarks are the property of their respective owners.

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS Section Page 1.0 Overview ………………………….………………………………………………………..…………………………..1-1 Topics day-by-day………………………………………………………………………………………………..1-3 Capabilities……………………………………………………………………………………………………… MSC.Nastran Thermal Analysis ……………………………………………………..…………………………..2-1 Overview…………………………………………………………………………………………………………..2-3 Heat Transfer, Modes of………………………………………………………………………………………..2-4 Heat Transfer Mathematics………………………………………………………………………………………2-6 MSC.Nastran Thermal Preference Table (MSC.Patran)…………………………………………………… MSC.Nastran Finite Elements………………………………….……………………………………………… MSC.Nastran Bulk Data Entries……………………………….……………………………………………… Format of the.DAT File……………...………………………….……………………………………………… Conduction ………………………………………………………………………………………………………… Comments on Conduction……………………………………………………………………………………….3-3 Conduction, Theory……………………………………………………………………………………………….3-4 Conduction, Capabilities…………………………………………………………………………………………3-5 Conduction, Supported Element Topologies…………………………………………………………………..3-6 MSC.Nastran Example Problems……………………………..………………………………………………..3-9 Project 1, Steady State Conduction………………………………………………………………….…….3-13 Constant Conduction………………………………………………………………………………… Temperature Dependent Conduction………………………………………………………………… 3- 29Workshop 1, Getting Started, Creating a Conduction Model………………………………….…………3-39 Conduction Through Anisotropic Material…………………………………………………………………… Element Coordinate Frames…………………………………………………………………………………… Material Orientation Defaults…………………………………………………………………………………….3-46

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS (Cont.) Section Page 3.0 Conduction (continued) ………………………………………………………………………………………… Anisotropic Conduction, MAT5………………………………………………………………………………… Project 2, Conduction for Anisotropic Materials…………………………………….…………………… Material Relative to Zero deg Rotation……………………………………………………………….3-51 Material Relative to 45 deg Rotation………………………………………………………………….3-57 Volumetric Heat Generation………………………………………………………………………..…………… 3-63 QVOL Bulk Data Entry…………………………………….…………………………………………………… QVOL Example…………………………………………….…………………………………………………… Workshop 2, Circuit Board and Chips Using Conduction and Heating…………………………………3-77

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS (Cont.) SectionPage 4.0 Convection …….………………………………………………….……………………………………………………4-1 Surface Elements…………………………………………………………………………………………………….4-3 CHBDYE……………………………………………………………………………………………………………….4-4 QBDY3…………………………………………………………………………………………………………………4-7 CONV…………………………………………………………………………………………………………………..4-8 Surface Load…………………………………………………………………………………………………………..4-9 Load Set……………………………………………………………………………………………………………… PCONV…………………………………………………………………………………………………………………4-13 CHBDYP……………………………………………………………………………………………………………….4-14 Example 1B………………………………………………………………………………………………………4-16 Example 1C………………………………………………………………………………………………………4-23 Convection, Theory ………………………………………………………………………………………………… Free Convection …………………………………………………………………………………………………… Project 3, Free Convection, H=H(temp) ………………………………………………………………………4-30 Workshop 3, Free Convection From Printed Circuit Board…………………………………………..…….4-47 Forced Convection ……………………………………………………………………………………………………4-49 CHBDYG……………………………………………………………………………………………………………….4-48 Thermal Loads…………………………………………………………………………………………………………4-50 Forms in Free Convection……………………………………………………………………………………………4-52 Free Convection Template………………………………………………………………………………………… Forced Convection……………………………………………………………………………………………………4-55 CONVM……………………………………………………………………………………………………………… PCONVM………………………………………………………………………………………………………………4-57 Forced Convection Example………………………………………………………………………………… Project 4, 1D Flow Networks …………………………………..…………………………………………… Workshop 4, Forcer Air Convection From Printed Circuit Board…………………………...………………4-77 Coupled Advection…………………………………………………………………………………………………….4-79 Project 5, Coupled Advection………………………………………………………………………………… Duct Flow …………………………………………………………………………………………………………… Duct Flow, Theory ……………………………………………………………………………………………………4-119 Workshop 5, Axisymmetric Flow in a Pipe…………………………………………………………………………4-133 Workshop 6, Typical Avionics Flow…………………………………………………………………………………4-133 Workshop 7, Thermal Contact Resistance…………………………………………………………………………4-133

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS (Cont.) SectionPage 5.0 Transient Thermal Analysis (SOL 159) …………..…………………………………………………………….5-1 MSC.Nastran Case and Bulk Data Control…………………………………………………………………………5-3 Convergence Control…………………………………………………………………………………………………5-13 MSC.Nastran Bulk Data TLOAD2 Entry……………………………………………………………………………5-14 Time Dependent Convection Coefficient………………………………………………………………………… Transient Solution Method……………………………………………………………………………………………5-24 Transient Solution Control……………………………………………………………………………………………5-25 Project 6, Transient Thermal analysis With Convection and Volumetric Heating ……………………….5-27 Workshop 8, Transient Thermal……………………………………………………………………………… Workshop 9, Transient Thermal Analysis of a Cooling Fin………………………………………………….5-61 Workshop 10, Holman Example 4-14, Radiation Heating and Cooling of Ceramics…………………….5-61 Workshop 11, Heating a Block of Ice Cream……………………………………………..………………….5-61 Thermostat Options………………………………………………………………………………………………… Thermostat Controller Using CONVM and RADBC……………………………………………………………… Radiation ……………………………………………………………………………………………………………….6-1 Radiation Topics ……………………………………………………………………………………………………..6-3 Radiation Theory ……………………………………………………………………………………………………. 6-4 Radiation Functionality ………………………………………………………………………………………………6-11 Ambient Radiation Exchange ……………………………………………………………………………………… 6-15 Example 1E……………………………………………………………………………………………………………6-19 Steady State Solution Method……………………………………………………………………………………….6-28 Steady State Solution Control……………………………………………………………………………………… Directional Heat Flux………………………………………………………………………………………………….6-33 Exercise 4B………………………………………………………………………………………………………6-35 Directional Fluxes,.DAT File…………………………………………………………………………………………6-41 Project 7, Directional Heat Loads……………………………………………………...………………………6-43 Workshop 12, Radiation to Space…………………………………………………………………………….6-56 Workshop 13, Directional Heat Loads…………………………………………………………………………6-56 Enclosure Radiation…………………………………………………………………………………………………..6-57

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS (Cont.) SectionPage 6.0 Radiation (continued) ……………………………………………………………………………………………….6-1 Self-Shadowing in View Factor Calculations…………………………………………………………… Third Surface Shadowing………………………………………………………………………………… View Factor Definition………………………………………………………………………………………6-61 Enclosure Radiation – View Factor……………………………………………………………………… Example 5A…………………………………………………………………………………………….6-64 Project 8, Single Cavity Enclosure Radiation…………………………………………………………………6-76 Ambient Element to Specify Different Ambient Temperature…………………………………………………….6-93 View Factors in the Punch File………………………………………………………………………………………6-97 Workshop 14, Radiation Enclosures……..……………………………………………………………………6-100 Axisymmetry View Factor…………………………………………………………………………………………… Concentric Sphere Axisymmetric View Factor…………………………………………………………………… Wavelength Dependent Emissivity………………………………………………………………………………… Two Element Under Radiation Exchange………………………………………………………………………….6-156

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS (Cont.) SectionPage 7.0 Additional Topics …………………………………………………………………………………………………….7-1 Topics ……………………………………………………………………………………………………… 7-3 Thermal Stress Analysis………………………………………………………………………………….7-4 Workshop 15, Thermal Stress Analysis With Directional Heat Loads………………………..….7-15 Workshop 16, Thermal Stress Analysis of a Bi-metalic Plate………..………………………… Using SOL 101 for Thermal Stress Analysis……………………………………………………………7-16 Restart a Transient Thermal Analysis……………………………………………………………………7-25 Restart for Thermal Stress Analysis……………………………………………………………………….7-33 Radiation Matrix…………………………………………………………………………………………… Thermostat Control Using NOLIN Bulk Data……………………………………………………………7-54 TABLEM Bulk Data for Scaling………………………………………………………………………… Enhancements in MSC.Nastran 2004…………………………………………………………………… Workshop 17, Import IGES File and Auto tet Mesh ……………………………….……………………7-79 Workshop 18, Create Group and List…………………………………………………………………… Appendix A