WS2-1 WORKSHOP 2 CIRCUIT BOARD AND CHIPS USING CONDUCTION AND HEATING NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation

WS2-2 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation

WS2-3 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation n Problem Description u Create model of a PCB and five chips connected to it with epoxy. Only 3D hexahedral conduction elements are used. The boundary conditions consist of heat flux applied to the free faces of the chips, and fixed temperature for the sides of the model. A steady-state thermal analysis is to be performed.

WS2-4 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation n Suggested Exercise Steps 1. Create a new database 2. Specify the tolerance 3. Create surfaces and curves for modeling 4. Create chain curves for trimmed surfaces 5. Trim trimmed surfaces 6. Mesh the surface for the circuit board 7. Create a Group for Base Component 8. Mesh the surfaces for the components 9. Create a group for epoxy material 10. Create elements for the epoxy 11. Create a Group for Chips 12. Create elements for the Chips 13. Create a group for circuit board 14. Create elements for the circuit board 15. Connect elements using equivalence

WS2-5 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation n Suggested Exercise Steps (continued) 16. Find element free edges using verify boundaries 17. Define material 18. Define property for PCB 19. Define property for chips 20. Define property for epoxy 21. Post all groups 22. Select picking preference 23. Apply heat flux 24. Apply boundary temperature 25. Create the analysis file 26. Run MSC.Nastran thermal 27. Access the results file 28. Display the results 29. Quit MSC.Patran

WS2-6 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 1: Create New Database Create new database a.File: New b.Enter pcb for File name. c.Click OK. c a b

WS2-7 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 2: Specify the Tolerance Specify the tolerance a.File: New… b.Select Default for Tolerance. c.Select MSC.Nastran for Analysis Code. d.Select Thermal for Analysis Type. e.Click OK. c a b d e

WS2-8 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 3: Create Surfaces and Curves for Modeling Create the surface representing the printed circuit board. a.Geometry: Create/Surface/XYZ b.Enter for Vector Coordinates List. c.Enter [0 0 0] for Origin Coordinates List. d.Click Apply. e.Enter for Vector Coordinates List. f.Enter [ ] for Origin Coordinates List. g.Click Apply. c a b g f d e

WS2-9 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 3: Create Surfaces and Curves for Modeling (Cont.) Create the surface representing the printed circuit board a.Geometry: Create/Surface/XYZ b.Enter for Vector Coordinates List. c.Enter [ ] for Origin Coordinates List. d.Click Apply. e.Geometry: Create/Curve/2D Circle. f.Click Input Radius g.Enter 0.75 for Circle Radius h.Enter [ ] for Center Point List. i.Click Apply c a b g h f d e

WS2-10 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 3: Create Surfaces and Curves for Modeling (Cont.) Create two circular components a.Geometry: Create/Curve/ 2D Circle b.Click Input Radius for Circle Radius. c.Enter [ ] for Center Point List. d.Click Apply. e.Enter [ ] for Center Point List. f.Click Apply. c a b f d e

WS2-11 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 4: Create Chain Curves for Trimmed Surfaces Create curve chain a.Geometry: Create/Curve/Chain. b.Enter Surface for Curve List. c.Click Apply. d.Enter Surface for Curve List. e.Click Apply. f.Enter Surface for Curve List. g.Click Apply. c a b g f d e

WS2-12 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 5: Create Trimmed Surfaces Create trimmed surfaces that will represent the components and the circuit board. a.Geometry: Create/Surface/Trimmed. b.Select Planar for Option. c.Enter Curve 4 for Outer Loop List. d.Enter Curve for Inner Loop List. e.Click Apply. f.Click NO for Do you wish to delete the original curves? c a b d e

WS2-13 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 5: Create Trimmed Surfaces (Cont.) Create trimmed surfaces that will represent the components and the circuit board. a.Geometry: Create/Surface/Trimmed b.Select Planar for Option. c.Select Curve 2 for Outer Loop List. d.Click Apply. e.Click NO for Do you wish to delete the original curves? c a b d e

WS2-14 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 5: Create Trimmed Surfaces (Cont.) Create trimmed surfaces that will represent the components and the circuit board. a.Geometry: Create/Surface/Trimmed b.Select Curve 1 for Outer Loop List. c.Click Apply. d.Click NO for Do you wish to delete the original curves? c a b

WS2-15 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 5: Create Trimmed Surfaces (Cont.) Create trimmed surfaces that will represent the components and the circuit board. a.Geometry: Create/Surface/Trimmed b.Select Curve 3 for Outer Loop List. c.Click Apply. d.Click NO for Do you wish to delete the original curves? c a b

WS2-16 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 6: Mesh the Surface for the Circuit board Mesh the surface for the circuit board. a.Elements: Create/Mesh/Surface b.Select Quad for Elem Shape. c.Select Paver for Mesher. d.Select Quad4 for Topology. e.Select Surface 4 for Surface List. f.Enter 0.1 for Value of Global Edge Length. g.Click Apply. c a b g f d e

WS2-17 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step7: Create a Group for Base Component Create group for base component a.Group/Create… b.Enter base_component. c.Click Apply. b a a c

WS2-18 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 8: Mesh the Surfaces for the Components Mesh the surfaces for the components. a.Elements: Create/Mesh/Surface b.Select Quad for Elem Shape. c.Select Paver for Mesher. d.Select Quad4 for Topology. e.Enter Surface for Surface List. f.Enter 0.1 for Value of Global Edge Length. g.Click Apply. c a b g f d e

WS2-19 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 9: Create a Group for Epoxy Material Create a group for epoxy material. a.Group/Create… b.Enter epoxy for New Group Name. c.Click Apply. c a b

WS2-20 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 10: Create Elements for the Epoxy Mesh the epoxy a.Elements: Sweep/Element/Extrude. b.Click Mesh Control… c.Enter 2 for Number. d.Click OK. e.Enter for Direction Vector. f.Enter 0.01 for Extrude Distance. g.Enter 0.0 for Offset. h.Enter Surface for Base Entity List. i.Click Apply. c a b i g h f d e

WS2-21 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 11: Create a Group for Chips Create a group for chips. a.Group/Create… b.Enter Chip for New Group Name. c.Click Apply. c a b

WS2-22 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 12: Create Elements for the Chips Create elements for the chips. a.Elements: Sweep/Element/Extrude. b.Enter for Direction Vector. c.Enter 0.4 for Extrude Distance. d.Enter 0.01 for Offset. e.Enter Surface for Base Entity List. f.Click Apply. c a b f d e

WS2-23 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 13: Create a Group for Circuit Board Create a group for circuit board a.Group/Create… b.Enter circuit_board for New Group Name. c.Click Apply. c a b

WS2-24 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 14: Create Elements for the Circuit Board Create elements for the circuit board. a.Elements: Sweep/Element/Extrude. b.Enter for Direction Vector c.Enter 0.2 for Extrude Distance. d.Enter Surface 2:7 for Base Entity List. e.Click Apply. c a b d e

WS2-25 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 15: Connect Elements a.Elements: Equivalence/All/Tolerance Cube. b.Enter for Equivalencing Tolerance. c.Click Apply. c a b

WS2-26 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 16: Find Element Free Edges Verify boundaries a.Elements: Verify/Element/Boundaries. b.Select Free Edges for Display Type. c.Click Apply. c a b

WS2-27 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 17: Define Material Define material of glue. a.Materials: Create/ Isotropic/ Manual Input. b.Enter glue for material name. c.Click Input Properties. d.Enter 0.2 for Thermal Conductivity. e.Click OK. f.Click Apply. c a b f d e

WS2-28 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 17: Define Material (Cont.) Define material of components. a.Materials: Create/isotropic/manual Input. b.Enter component for Material Name. c.Click Input Properties.. d.Enter 0.89 for Thermal Conductivity. e.Click OK. f.Click Apply. c a b f d e

WS2-29 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 17: Define Material (Cont.) Define material of circuit board. a.Materials: Create/Isotropic/Manual Input. b.Enter circuit_board for Material Name. c.Click Input Properties… d.Enter 0.3 for Thermal Conductivity. e.Click OK. f.Click Apply. c a b f d e

WS2-30 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 18: Define Property for PCB Post circuit board group. a.Group/Post… b.Select circuit_board c.Click Apply. c a b

WS2-31 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 18: Define Property for PCB (Cont.) Define property for pcb. a.Properties: Create/3D/Solid b.Enter pcb for Property Set name. c.Click Input properties… d.Click in the material Name box and select circuit_board under Material Property Sets. e.Click OK. f.Select the entire of the screen for Select Members. g.Click Add. h.Click Apply. c a b g h f d e

WS2-32 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 19: Define Property for Chips Define property for chips a.Group/Post… b.Select chip for Select Groups to Post. c.Click Apply. c a b

WS2-33 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 19: Define Property for Chips (Cont.) Define property for chips a.Properties/Create/3D/Solid b.Enter chip for Property Set name. c.Click Input Properties… d.Click in the Material Name box and select component under material Property Sets. e.Click OK. f.Select the entire of the screen for Select members. g.Click Add. h.Click Apply c a b g h f d e

WS2-34 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 20: Define Property for Epoxy Define property for epoxy a.Group/Post… b.Select epoxy for Select Groups to Post. c.Click Apply. c a b

WS2-35 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 20: Define Property for Epoxy (Cont.) Define property for epoxy a.Properties: Create/3D/Solid b.Enter epoxy for Property Set Name c.Click Input properties… d.Click in the Material Name box and select glue under Material Property Sets. e.Click OK. f.Select the entire screen for select Members. g.Click Add. h.Click Apply. c a b g h f d e

WS2-36 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 21:Post All Groups Post all a.Group/Post… b.Select all for Select Groups to Post. c.Click Apply. c a b

WS2-37 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 22: Select Picking Preference Select picking a.Preferences: Picking. b.Select Enclose entire entity for Rectangle/Polygon Picking. c.Click Close. c a b

WS2-38 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 23: Apply Heat Flux Apply heat flux a.Loads/BCs: Create/Applied heat/Element Uniform b.Select normal Fluxes for Option. c.Enter heatflux for New Set name. d.Select 3D for Target Element Type. e.Click Input Data… f.Enter 3 for Heat Flux. g.Click OK. h.Click Select Application Region… i.See figure for Select 3D Element Faces. j.Click Add. k.Click OK. l.Click Apply. c a b l j k i g h f d e

WS2-39 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 24: Apply Boundary Temperature Apply boundary temperature a.Loads/BCs: Create/Temp/Nodal. b.Enter temp_edge for New Set name. c.Click Input Data… d.Enter 40 for Boundary Temperature. e.Click OK. f.Click Select Application Region… g.See Figure for Select Nodes. h.Click Add. i.Click OK. c b i g h f d e a g

WS2-40 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 25: Create the Analysis File Perform the analysis a.Analysis:Analyze/Entire Model/Analysis Deck. b.Click Translation parameters… c.Select XDB and Print for Data Output. d.Click OK. e.Click Solution Type. f.Select STEADY STATE ANALYSIS for Solution Type. g.Click Solution Parameters. h.Enter 70 for Default Inlt Temperature. i.Click OK. j.Click OK. k.Click Apply. j g c b k f d e i h a

WS2-41 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 26: Run MSC.Nastran Thermal Run MSC Patran a.Run MSC Natran. b.Select pcb.bdf. c.Click Open d.Click Run c a b d

WS2-42 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 27: Access the Results File Attach the XDB file a.Analysis: Attach XDB/Result Entities/Local b.Click Select Results File… c.Select pcb.xdb for File name. d.Click OK. e.Click Apply. c b d e a

WS2-43 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 28: Display the Results Display the result. a.Results: Create/Quick Plot. b.Select SC1:DEFAULT, At.. For Select Result Cases. c.Select Temperatures for Select Fringe Result. d.Click Apply. c a b d

WS2-44 NAS104, Workshop 2, March 2004 Copyright 2004 MSC.Software Corporation Step 29: Quit MSC.Patran Quit MSC.Patran a.Select File on the Menu Bar and select Quit from the drop down menu a