Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation MSC.Nastran Thermal Analysis MSC.Nastran 2004 NAS104 Workshops March 2004 MSC.Software Corporation United States MSC.Patran Support Tel: Fax: Tokyo, Japan Tel: Fax: Munich, Germany Tel: (+49) Fax: (+49) MacArthur Place Santa Ana, CA 92707, USA Tel: (714) Fax: (714) Web: Part Number: NA*V2004*Z*Z*Z*SM-NAS104-WBK

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Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS Workshop Page 1.0 Getting Started, Creating a Conduction Model ……………………………..……………………………… Circuit Board and Chips Using Conduction and Heating ……………………………………………… Free Convection From Printed Circuit Board …………..………………………………………………… Forced Air Convection From Printed Circuit Board …………..………………………………………… Axisymmetric Flow in a Pipe ……………………...………..…………………………………………………… Typical Avionics Flow ……………………………….…………………………………………………………… Thermal Contact Resistance …………………………………………………………………………………… Transient Thermal ……………………...………..………………………………………………………………… Transient Thermal Analysis of a Cooling Fin …………..…………………………………………………… Transient Analysis With Radiation Source… …………….………………………………..……………… Heating a Block of Icecream …………….………………..……………………………………………………… Solution of a Simple Radiation to Space Problem …………………………………….………..………… Directional Heat Loads …..………..……………………….………..…………………………………………… Radiation Enclosures …………………..…….………..………………………………………………………… Thermal Stress Analysis With Directional Heat Loads ……………………….………………………… Thermal Stress Analysis of a Bi-metalic Plate ……………………………….…………………………… Import IGES File and Auto tet Mesh ………………………….……………………………………………… Create Group and List ………………………….………………………………..………………………………… MSC.Nastran Bulk Data ………………….…….………………………………..………………………………… Shield ………………………………….…………….………………………………..………………………………… Thermal stress …………………….…………..….………………………………..…………………………………21-1

Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation